US 11,784,189 B2
Monolithic integration of diverse device types with shared electrical isolation
Francois Hebert, San Mateo, CA (US); and Handoko Linewih, (SG)
Assigned to GlobalFoundries U.S. Inc., Malta, NY (US)
Filed by GLOBALFOUNDRIES U.S. Inc., Malta, NY (US)
Filed on Aug. 20, 2021, as Appl. No. 17/407,680.
Prior Publication US 2023/0059665 A1, Feb. 23, 2023
Int. Cl. H01L 27/12 (2006.01); H01L 21/84 (2006.01); H01L 27/085 (2006.01); H01L 29/872 (2006.01)
CPC H01L 27/1203 (2013.01) [H01L 21/84 (2013.01); H01L 27/085 (2013.01); H01L 29/872 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A structure comprising:
a substrate including a device layer, a handle substrate, and a buried insulator layer between the handle substrate and the device layer;
a first semiconductor layer on the device layer in a first device region, the first semiconductor layer comprising a III-V compound semiconductor material;
a second semiconductor layer on the device layer in a second device region, the second semiconductor layer comprising silicon;
a high-electron-mobility transistor including a gate structure on the first semiconductor layer; and
a second device structure including a doped region in the second semiconductor layer, the doped region and the second semiconductor layer defining a p-n junction.