US 11,784,109 B2
Method and system for driving piezoelectric MEMS-based active cooling devices
Suryaprakash Ganti, Los Altos, CA (US); and Seshagiri Rao Madhavapeddy, La Jolla, CA (US)
Assigned to Frore Systems Inc., San Jose, CA (US)
Filed by Frore Systems Inc., Los Altos, CA (US)
Filed on Mar. 29, 2019, as Appl. No. 16/369,821.
Claims priority of provisional application 62/717,474, filed on Aug. 10, 2018.
Prior Publication US 2020/0049388 A1, Feb. 13, 2020
Int. Cl. F25B 21/02 (2006.01); H01L 23/473 (2006.01); F04B 53/10 (2006.01); F04B 43/04 (2006.01); F04B 45/047 (2006.01); B06B 1/06 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H05K 7/20 (2006.01); F04D 33/00 (2006.01); H04M 1/02 (2006.01); F04B 43/09 (2006.01); H01L 23/46 (2006.01); H01L 23/42 (2006.01); F04B 17/00 (2006.01); F04B 45/04 (2006.01); H10N 30/00 (2023.01); H10N 30/20 (2023.01); H10N 30/80 (2023.01); H10N 35/80 (2023.01)
CPC H01L 23/4735 (2013.01) [B06B 1/06 (2013.01); F04B 17/003 (2013.01); F04B 43/04 (2013.01); F04B 43/046 (2013.01); F04B 43/095 (2013.01); F04B 45/043 (2013.01); F04B 45/047 (2013.01); F04B 53/1077 (2013.01); F04D 33/00 (2013.01); F25B 21/02 (2013.01); H01L 23/42 (2013.01); H01L 23/427 (2013.01); H01L 23/433 (2013.01); H01L 23/4336 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H04M 1/0202 (2013.01); H05K 7/20 (2013.01); H05K 7/20009 (2013.01); H05K 7/2039 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H10N 30/00 (2023.02); H10N 30/20 (2023.02); H10N 30/204 (2023.02); H10N 30/2047 (2023.02); H10N 30/80 (2023.02); H10N 35/80 (2023.02); F25B 2321/023 (2013.01); F25B 2321/025 (2013.01); F25B 2321/0212 (2013.01); F25B 2321/0252 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A system for cooling a heat-generating structure comprising:
an array of cooling elements corresponding to regions of the heat-generating structure where heat is generated in response to operation of the heat-generating structure, a cooling element in the array of cooling elements being in a chamber and in communication with a fluid, the cooling element having a first side and a second side opposite to the first side, the first side being distal from the heat-generating structure, the second side being proximate to the heat-generating structure, the cooling element being between an entrance for the chamber and the heat-generating structure, at least a portion of the cooling element undergoing vibrational motion in response to the cooling element being activated, the vibrational motion drawing the fluid into the chamber through the entrance and directing the fluid from to the first side to the second side, the at least the portion of the cooling element undergoing the vibrational motion being integrally formed and valve-free, the array of cooling elements including a plurality of piezoelectric cooling elements;
an orifice plate having at least one orifice therein, the orifice plate being disposed between the plurality of piezoelectric cooling elements and the heat-generating structure, the array of cooling elements being at least fifty microns and not more than five hundred microns from the orifice plate, each piezoelectric cooling element of the plurality of piezoelectric cooling elements having a length of at least three millimeters and not more than seven millimeters and wherein the orifice plate is at least fifty microns and not more than five hundred microns from the heat-generating structure; and
a controller configured to activate portions of the array of cooling elements based on a determination that the operation of the heat-generating structure is likely to generate the heat in a given region of the heat-generating structure.