	US 11,782,432 B2
	Method and system for controlling lot risk score based dynamic lot measurement on basis of equipment reliability index
Tae Young Hong, Seongnam-si (KR); and Jin Woo Park, Hwaseong-si (KR)
Assigned to SK HOLDINGS CO., LTD., Seoul (KR)
Appl. No. 16/622,097
Filed by SK HOLDINGS CO., LTD., Seoul (KR)
PCT Filed May 25, 2018, PCT No. PCT/KR2018/005943 § 371(c)(1), (2) Date Dec. 12, 2019, PCT Pub. No. WO2018/230853, PCT Pub. Date Dec. 20, 2018.
Claims priority of application No. 10-2017-0074579 (KR), filed on Jun. 14, 2017.
Prior Publication US 2021/0191382 A1, Jun. 24, 2021
Int. Cl. G05B 23/02 (2006.01); G05B 19/4065 (2006.01); G01R 31/26 (2020.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01)

CPC G05B 23/0283 (2013.01) [G01R 31/26 (2013.01); G05B 19/4065 (2013.01); G05B 23/0221 (2013.01); G05B 23/0259 (2013.01); H01L 21/02 (2013.01); H01L 21/67276 (2013.01); H01L 21/67 (2013.01)]

8 Claims

1. A measurement control method for performing automatic and dynamic lot measurement control in semiconductor manufacturing, the method being performed by using a measurement device and a measurement control device including a communication unit and a processor configured to perform the measurement control method based on a dynamic lot measurement control algorithm, the method comprising:

obtaining, by using the measurement device, process and equipment data regarding a semiconductor manufacturing equipment for a semiconductor manufacturing process in semiconductor manufacturing,

receiving the process and equipment data via the communication unit;

based on the received process and equipment data, calculating, by the processor, an equipment reliability index of the semiconductor manufacturing equipment for the semiconductor manufacturing process in the semiconductor manufacturing;

calculating, by the processor, a lot risk score excursion L_ex,

calculating, by the processor, a lot risk score of the semiconductor manufacturing equipment for the semiconductor manufacturing process, on a basis of the equipment reliability index and the lot risk score excursion; and

automatically determining, by the processor, whether to measure a semiconductor product which is processed in the semiconductor manufacturing equipment for the semiconductor manufacturing process and moved out of the semiconductor manufacturing equipment, on a basis of the lot risk score,

wherein the measurement control device further includes a memory storing instructions executable by the processor to perform the dynamic lot measurement control algorithm,

wherein the calculating of the equipment reliability index comprises:

calculating, by the processor, a process stability for the semiconductor manufacturing process by using the following equation: S_op=Min(Cpk, 1), Cpk=Min{(USL−m)/3σ, (m−LSL)/3σ}, wherein Min is a minimum value of listed values, m is a target value on process specifications, USL is a upper specification limit, LSL is a lower specification limit, and σ is a standard deviation,

calculating, by the processor, an equipment stability for the semiconductor manufacturing equipment on a basis of L_cntand L_fdc, wherein L_fdcis the number of times that FDC (Fault Detection and Classification) Interlock occurred during a predetermined previous time period, and

calculating, by the processor, the equipment reliability index based on the process stability and the equipment stability,

wherein the lot risk score excursion L_exis calculated based on L_m/o/L_avg,

wherein L_avg=L_mes/L_cnt,

wherein L_cntis the total number of lots processed in the semiconductor manufacturing equipment during the predetermined previous time period, L_mesis the number of lots measured during the predetermined previous time period, and L_m/ois the number of lots which are processed in the semiconductor manufacturing equipment and moved out of the semiconductor manufacturing equipment, but excluding lots which skipped from measurement, and L_avgis an average ratio of the number of measured lots over the total number of processed lots,

wherein the calculating of the lot risk score comprises calculating the lot risk score by using the following equation: Lot risk score=1−(the equipment reliability index×the lot risk score excursion L_ex),

wherein the receiving of the process and equipment data, the calculating of the process stability, the calculating of the equipment stability, and the calculating of the equipment reliability index based on the process stability and the equipment stability are performed periodically by the processor based on the dynamic lot measurement control algorithm, and

wherein the calculating of the lot risk score excursion L_ex, the calculating of the lot score risk based on the equipment reliability index and the lot risk score excursion L_ex, and the automatically determining of whether to measure the semiconductor product processed in the semiconductor manufacturing equipment and moved out of the semiconductor manufacturing equipment are performed by the processor based on the dynamic lot measurement control algorithm in real time whenever a semiconductor product is processed by the semiconductor manufacturing equipment and is moved out of the semiconductor manufacturing equipment.