CPC G02B 5/285 (2013.01) [G02B 1/10 (2013.01); G02B 5/281 (2013.01); G02B 5/283 (2013.01); H01L 27/14621 (2013.01); H01L 27/14685 (2013.01)] | 20 Claims |
1. A method comprising:
applying a photoresist layer onto a substrate;
forming, in the photoresist layer surrounding a region of the substrate, an overhang by patterning the photoresist layer in a manner that uncovers the region; and
lifting the photoresist layer in a manner that provides a clean lift-off of the photoresist layer without breaking a coating that covers the overhang.
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