US 11,782,019 B2
Surface treatment of semiconductor sensors
Ronald L. Cicero, Menlo Park, CA (US); Marc Glazer, San Jose, CA (US); Yufang Wang, San Carlos, CA (US); Christina E Inman, San Mateo, CA (US); Jeremy Gray, Larkspur, CA (US); Joseph Koscinski, Richmond, CA (US); James A. Ball, Ledyard, CT (US); Phil Waggoner, Guilford, CT (US); and Alexander Mastroianni, Alameda, CA (US)
Assigned to Life Technologies Corporation, Carlsbad, CA (US)
Filed by Life Technologies Corporation, Carlsbad, CA (US)
Filed on Oct. 1, 2020, as Appl. No. 17/60,680.
Application 17/060,680 is a continuation of application No. 14/789,795, filed on Jul. 1, 2015, granted, now 10,809,225.
Claims priority of provisional application 62/020,299, filed on Jul. 2, 2014.
Prior Publication US 2021/0102916 A1, Apr. 8, 2021
Int. Cl. G01N 27/414 (2006.01)
CPC G01N 27/4145 (2013.01) 21 Claims
OG exemplary drawing
 
1. A method of preparing a sensor component, the method comprising:
flowing a wash solution over a sensor device, the sensor device including:
a sensor array; each sensor in the sensor array having a sensor surface comprising a metal, metal or semi-metal oxide, or metal or semi-metal nitride; and
an array of wells formed over and operatively coupled to the sensor array, each well providing a sidewall of a reaction site; and
applying a surface agent to the sensor device, the surface agent including:
a first moiety reactive with the sensor surface, the sidewall, or combinations thereof;
the first moiety including phosphate, phosphonic acid, phosphinic acid, and phosphonate, or any combination thereof; and
a second moiety distal from the first moiety comprising a positively charged functional group.