CPC G01B 11/24 (2013.01) [G01B 11/26 (2013.01); G01N 21/956 (2013.01); H05K 3/00 (2013.01); G01N 2021/95638 (2013.01)] | 20 Claims |
1. A printed circuit board comprising:
a plurality of layers each comprising a fiber weave comprising a plurality of fiber bundles woven to form the fiber weave;
a plurality of markers embedded into a layer of the plurality of layers and located at a distance from each other; and
an inspection window formed in at least one other layer of the plurality of layers of the printed circuit board for use in identifying a location of the plurality of markers in the fiber weave.
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