US 11,781,858 B2
Fiber weave skew assessment for printed circuit boards
Amendra Koul, San Francisco, CA (US); Yaochao Yang, Fremont, CA (US); Mike Sapozhnikov, San Jose, CA (US); Joel Richard Goergen, Soulsbyville, CA (US); and Kartheek Nalla, Milpitas, CA (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Jan. 11, 2022, as Appl. No. 17/573,219.
Application 17/573,219 is a division of application No. 16/868,423, filed on May 6, 2020, granted, now 11,287,245.
Application 16/868,423 is a division of application No. 15/872,163, filed on Jan. 16, 2018, granted, now 10,684,123, issued on Jun. 16, 2020.
Prior Publication US 2022/0128350 A1, Apr. 28, 2022
Int. Cl. G01B 11/24 (2006.01); G01N 21/956 (2006.01); G01B 11/26 (2006.01); H05K 3/00 (2006.01)
CPC G01B 11/24 (2013.01) [G01B 11/26 (2013.01); G01N 21/956 (2013.01); H05K 3/00 (2013.01); G01N 2021/95638 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a plurality of layers each comprising a fiber weave comprising a plurality of fiber bundles woven to form the fiber weave;
a plurality of markers embedded into a layer of the plurality of layers and located at a distance from each other; and
an inspection window formed in at least one other layer of the plurality of layers of the printed circuit board for use in identifying a location of the plurality of markers in the fiber weave.