US 11,781,200 B2
Plated steel
Kohei Tokuda, Tokyo (JP); Takuya Mitsunobu, Tokyo (JP); Mamoru Saito, Tokyo (JP); Yuto Fukuda, Tokyo (JP); Yasuto Goto, Tokyo (JP); Hidetoshi Shindo, Tokyo (JP); Fumiaki Nakamura, Tokyo (JP); Koji Kawanishi, Tokyo (JP); and Ryohei Mimura, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 18/14,466
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Jul. 9, 2021, PCT No. PCT/JP2021/025900
§ 371(c)(1), (2) Date Jan. 4, 2023,
PCT Pub. No. WO2023/281729, PCT Pub. Date Jan. 12, 2023.
Prior Publication US 2023/0193425 A1, Jun. 22, 2023
Int. Cl. C22C 18/04 (2006.01)
CPC C22C 18/04 (2013.01) 16 Claims
 
1. A plated steel comprising a plated layer on a surface of a steel, wherein
an average chemical composition of the plated layer is formed of, by mass %,
50.00% or more of Zn,
more than 10.00% and less than 40.00% of Al,
more than 5.00% and less than 12.50% of Mg,
0% or more and 3.00% or less of Sn,
0% or more and 1.00% or less of Bi,
0% or more and 1.00% or less of In,
0.03% or more and 2.00% or less of Ca,
0% or more and 0.50% or less of Y,
0% or more and 0.50% or less of La,
0% or more and 0.50% or less of Ce,
0% or more and 2.50% or less of Si,
0% or more and 0.25% or less of Cr,
0% or more and 0.25% or less of Ti,
0% or more and 0.25% or less of Ni,
0% or more and 0.25% or less of Co,
0% or more and 0.25% or less of V,
0% or more and 0.25% or less of Nb,
0% or more and 0.25% or less of Cu,
0% or more and 0.25% or less of Mn,
more than 0% and 5.00% or less of Fe,
0% or more and 0.50% or less of Sr,
0% or more and 0.50% or less of Sb,
0% or more and 0.50% or less of Pb,
0% or more and 0.50% or less of B,
0% or more and 0.50% or less of Li,
0% or more and 0.50% or less of Zr,
0% or more and 0.50% or less of Mo,
0% or more and 0.50% or less of W,
0% or more and 0.50% or less of Ag,
0% or more and 0.50% or less of P,
and impurities,
the following Expression 1 and Expression 2 are satisfied, and
Expression 3 and Expression 6 are further satisfied in an X-ray diffraction pattern of a surface of the plated layer measured using Cu-Kα rays under a condition that an X-ray output is 40 kV and 150 mA,
0≤Cr+Ti+Ni+Co+V+Nb+Cu+Mn≤0.25  Expression 1
0≤Sr+Sb+Pb+B+Li+Zr+Mo+W+Ag+P≤0.50  Expression 2
I(MgZn2(41.31°))/IΣ(MgZn2)≤0.265  Expression 3
0.150≤{I(MgZn2(20.79°))+I(MgZn2(42.24°))}/IΣ(MgZn2)  Expression 6
(Here, this is provided that the element symbols in Expression 1 and Expression 2 each indicate an amount (mass %) of each element by mass % in the plated layer, and 0 is substituted when the element is not contained, and
IΣ(MgZn2), I(MgZn2 (41.31°)), I(MgZn2 (20.79°)), and I(MgZn2 (42.24°)) in Expression 3 and Expression 6 are as follows, and IΣ(Mg2Sn) is 0 when the plated layer does not contain Sn,
IΣ(MgZn2): A sum of intensities of diffraction peaks of a (100) plane, a (002) plane, a (101) plane, a (102) plane, a (110) plane, a (103) plane, a (112) plane, a (201) plane, a (004) plane, a (203) plane, a (213) plane, a (220) plane, a (313) plane, and a (402) plane of MgZn2,
I(MgZn2 (41.31°)): An intensity of the diffraction peak of the (201) plane of MgZn2,
I(MgZn2 (20.79°)): An intensity of the diffraction peak of the (002) plane of MgZn2,
I(MgZn2 (42.24°)): An intensity of the diffraction peak of the (004) plane of MgZn2).