US 11,780,227 B2
Molded structures with channels
Chien-Hua Chen, Corvallis, OR (US); Michael W Cumbie, Corvallis, OR (US); and Michael G Groh, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/312,360
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jun. 25, 2019, PCT No. PCT/US2019/039074
§ 371(c)(1), (2) Date Jun. 9, 2021,
PCT Pub. No. WO2020/263234, PCT Pub. Date Dec. 30, 2020.
Prior Publication US 2022/0111647 A1, Apr. 14, 2022
Int. Cl. B41J 2/16 (2006.01); B41J 2/14 (2006.01); B41J 2/18 (2006.01)
CPC B41J 2/1639 (2013.01) [B41J 2/14016 (2013.01); B41J 2/14201 (2013.01); B41J 2/1601 (2013.01); B41J 2/1607 (2013.01); B41J 2/1625 (2013.01); B41J 2/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a molded structure comprising thermo-electric traces and channels; the channels between ten μm and two hundred μm, or less in one dimension;
a fluid recirculation channel; and
a dependent device coupled to the molded structure and comprising apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel, the dependent device also comprising contacts corresponding to the thermo-electric traces of the molded structure.