US 11,780,223 B2
Pulldown devices
James Michael Gardner, Corvallis, OR (US); John Rossi, Vancouver, WA (US); and Scott A. Linn, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
Filed on Jul. 19, 2022, as Appl. No. 17/868,164.
Application 17/868,164 is a continuation of application No. 16/768,059, granted, now 11,413,861, previously published as PCT/US2019/016730, filed on Feb. 6, 2019.
Prior Publication US 2022/0348010 A1, Nov. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B41J 2/045 (2006.01)
CPC B41J 2/04541 (2013.01) [B41J 2/04586 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An integrated circuit for a fluid ejection device, the integrated circuit comprising:
a plurality of contact pads comprising a first contact pad and a second contact pad;
a first pulldown device coupled to one of the first contact pad or the second contact pad; and
control logic to enable the first pulldown device in response to both a logic low signal on the first contact pad and a logic low signal on the second contact pad.