US 11,780,049 B2
Polishing carrier head with multiple angular pressurizable zones
Steven M. Zuniga, Soquel, CA (US); Jay Gurusamy, Santa Clara, CA (US); Andrew J. Nagengast, Sunnyvale, CA (US); and Vladimir Galburt, Campbell, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 25, 2021, as Appl. No. 17/359,410.
Claims priority of provisional application 63/045,680, filed on Jun. 29, 2020.
Prior Publication US 2021/0402558 A1, Dec. 30, 2021
Int. Cl. B24B 37/30 (2012.01); B24B 37/10 (2012.01); B24B 37/005 (2012.01); B24B 37/32 (2012.01)
CPC B24B 37/30 (2013.01) [B24B 37/005 (2013.01); B24B 37/105 (2013.01); B24B 37/32 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A carrier head for holding a substrate in a polishing system, comprising:
a housing;
a flexible membrane extending below the housing, the flexible membrane dividing a volume above the flexible membrane into a multiplicity of independently pressurizable chambers;
a first plurality of individually pressurizable pressure supply lines;
a second plurality of individually pressurizable pressure supply lines; and
a valve assembly coupled to the first plurality of pressure supply lines, the second plurality of pressure supply lines and the multiplicity of independently pressurizable chambers, the valve assembly having a multiplicity of valves, wherein each respective valve of the multiplicity of valves is coupled to one respective pressurizable chamber from the multiplicity of independently pressurizable chambers, and wherein each respective valve is configured to selectively couple the one respective pressurizable chamber to one pressure supply line from a respective pair of pressure supply lines, each respective pair of pressure supply lines including a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.