US D1,096,069 S
Shaping jumpsuit
Zhennan Xu, Hong Kong (CN); Rongqing Xu, Hong Kong (CN); Jun Zeng, Hong Kong (CN); and Huijuan Lin, Hong Kong (CN)
Filed by HEXIN HOLAING LIMITED, Hong Kong (CN)
Filed on Jan. 15, 2024, as Appl. No. 29/908,739.
Term of patent 15 Years
LOC (15) Cl. 02 - 01
U.S. Cl. D 2—704
OG exemplary drawing
 
The ornamental design for a shaping jumpsuit as shown and described.