US 12,439,781 B2
Flexible display including layer within groove or opening of flexible substrate
Nam Jin Kim, Suwon-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Mar. 29, 2022, as Appl. No. 17/657,000.
Application 17/657,000 is a continuation of application No. 16/786,657, filed on Feb. 10, 2020, granted, now 11,289,680.
Application 16/786,657 is a continuation of application No. 16/358,375, filed on Mar. 19, 2019, granted, now 10,559,779, issued on Feb. 11, 2020.
Application 16/358,375 is a continuation of application No. 15/240,820, filed on Aug. 18, 2016, granted, now 10,270,059, issued on Apr. 23, 2019.
Claims priority of application No. 10-2015-0118837 (KR), filed on Aug. 24, 2015.
Prior Publication US 2022/0223821 A1, Jul. 14, 2022
Int. Cl. H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H10K 50/844 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H10K 59/121 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 50/844 (2023.02); H10K 71/00 (2023.02); H10K 77/111 (2023.02); H10K 59/1213 (2023.02); H10K 59/1216 (2023.02); H10K 2102/311 (2023.02); Y02E 10/549 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A flexible display, comprising:
a flexible substrate including a display area where a display unit is disposed and a non-display area adjacent to the display area, the non-display area including a bending area;
an inorganic insulating layer disposed on the flexible substrate;
at least one groove in the inorganic insulating layer in the non-display area;
an organic insulating layer disposed in the at least one groove; and
a plurality of wires disposed on the inorganic insulating layer and the organic insulating layer,
wherein the display unit includes a thin-film transistor, and an organic light-emitting diode, and the thin-film transistor includes a source electrode and a drain electrode,
wherein the plurality of wires includes a same material and is disposed on a same layer as the source electrode and the drain electrode,
wherein the at least one groove in the inorganic insulating layer is disposed in the bending area, wherein the plurality of wires directly contact the organic insulating layer in the bending area, and
wherein the plurality of the wires are electrically connected to a driving chip.