| CPC H10K 59/1201 (2023.02) [H10K 59/121 (2023.02); H10K 59/131 (2023.02); H10K 59/88 (2023.02)] | 20 Claims |

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1. A display module having a bonding region, the display module comprising:
a first bonding component including a plurality of first test pins and a plurality of first function pins that are disposed in the bonding region and arranged in a first direction; and
a second bonding component including a plurality of second test pins and a plurality of second function pins that are disposed in the bonding region and arranged in the first direction, wherein the plurality of second test pins and the plurality of first test pins are coupled to constitute a plurality of test pin pairs, the plurality of second function pins and the plurality of first function pins are coupled to constitute a plurality of function pin pairs, and the plurality of test pin pairs and the plurality of function pin pairs constitute a pin row;
wherein the first bonding component further includes at least one first dummy pin disposed in the bonding region, and a first dummy pin of the at least one first dummy pin is located on an outer side of the pin row in the first direction.
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