US 12,439,766 B2
Encapsulation system for an optoelectronic component comprising at least a first encapsulation and a second encapsulation, and optoelectronic component comprising an encapsulation system of this kind
Merve Anderson, Dresden (DE); Michael Eritt, Dresden (DE); Judith Geoerg, Dresden (DE); Michael Meissner, Dresden (DE); and Ralph Wichtendahl, Dresden (DE)
Assigned to HELIATEK GMBH, Dresden (DE)
Appl. No. 17/790,763
Filed by HELIATEK GMBH, Dresden (DE)
PCT Filed Jan. 5, 2021, PCT No. PCT/DE2021/100001
§ 371(c)(1), (2) Date Jul. 5, 2022,
PCT Pub. No. WO2021/139853, PCT Pub. Date Jul. 15, 2021.
Claims priority of application No. 10 2020 200 053.0 (DE), filed on Jan. 6, 2020.
Prior Publication US 2023/0036237 A1, Feb. 2, 2023
Int. Cl. H10K 30/88 (2023.01); H10F 19/80 (2025.01)
CPC H10K 30/88 (2023.02) [H10F 19/80 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An encapsulation system for an optoelectronic component, comprising:
a first encapsulation formed from at least one front barrier layer on a front face of the optoelectronic component and at least one rear barrier layer on a reverse face of the optoelectronic component with at least one first connecting material forming a first connecting material body disposed in between the at least one front barrier layer and the at least one rear barrier layer along an entire extent of the at least one front barrier layer and the at least one rear barrier layer; and
a second encapsulation formed from at least one front protective layer on the front face of the optoelectronic component and at least one rear protective layer on the reverse face of the optoelectronic component with at least one second connecting material forming a second connecting material body disposed in between, wherein:
the first encapsulation surrounds the optoelectronic component such that the first encapsulation projects beyond the optoelectronic component by a first edge region, the at least one front barrier layer is bonded to the at least one rear barrier layer in the first edge region such that the at least one front barrier layer and the at least one rear barrier layer are cohesively joined to one another,
the first connecting material and the second connecting material are each an adhesive or form an adhesive layer,
the second encapsulation surrounds the first encapsulation comprising the optoelectronic component such that the second encapsulation projects beyond the first edge region of the first encapsulation by a second edge region,
the first encapsulation is formed over an entire extent of the optoelectronic component,
the second encapsulation is formed over an entire extent of the first encapsulation,
the first edge region of the first encapsulation is formed around the optoelectronic component, and the second edge region of the second encapsulation is formed around the first encapsulation,
the at least one front protective layer is bonded to the at least one rear protective layer in the second edge region such that the at least one front protective layer and the at least one rear protective layer are cohesively joined to one another,
the width of the first edge region is 5 mm to 200 mm, and/or the width of the second edge region is 5 mm to 100 mm, and
the optoelectronic component is a flexible optoelectronic component, and wherein a layer thickness of the first encapsulation decreases in part toward the first edge region and a layer thickness of the second encapsulation decreases in part toward the second edge region.