US 12,439,758 B2
Wafer having auxiliary pattern for aligning light emitting device and method of fabricating unit pixel using the same
Namgoo Cha, Gyeonggi-do (KR); Seongchan Park, Gyeonggi-do (KR); and Jae Hee Lim, Gyeonggi-do (KR)
Assigned to SEOUL VIOSYS CO., LTD., Ansan-si (KR)
Filed by SEOUL VIOSYS CO., LTD., Gyeonggi-do (KR)
Filed on Oct. 6, 2021, as Appl. No. 17/495,451.
Claims priority of provisional application 63/089,610, filed on Oct. 9, 2020.
Prior Publication US 2022/0115437 A1, Apr. 14, 2022
Int. Cl. H10H 29/14 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01)
CPC H10H 29/142 (2025.01) [H10H 20/01 (2025.01); H10H 20/857 (2025.01); H10H 20/036 (2025.01)] 19 Claims
OG exemplary drawing
 
1. A wafer for fabricating a unit pixel, the wafer comprising:
a transparent substrate; and
a light blocking layer disposed on the transparent substrate, wherein:
the light blocking layer includes a plurality of unit pixel regions and a plurality of observation regions including an observation region;
each of the plurality of unit pixel regions has a first mounting region configured to mount a light emitting device; and
the observation region includes a second mounting region configured to mount the light emitting device and an auxiliary pattern disposed around the second mounting region,
wherein the auxiliary pattern comprises an intaglio or embossed line,
wherein the plurality of observation regions is disposed adjacent to one another, and two or more of the plurality of observation regions have different auxiliary patterns from one another.