| CPC H10H 20/831 (2025.01) [H01L 25/0753 (2013.01); H10H 20/835 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01); H10H 20/032 (2025.01); H10H 20/0362 (2025.01); H10H 20/0364 (2025.01)] | 18 Claims |

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1. A semiconductor light emitting device package comprising:
a light emitting structure having a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer;
a first electrode and a second electrode electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the light emitting structure, respectively;
an interlayer insulating layer disposed on a side surface of the light emitting structure; and
an adhesive layer disposed on the light emitting structure,
wherein the first electrode comprises a first reflective electrode and a first pad electrode,
wherein the second electrode also comprises a second reflective electrode and a second pad electrode,
wherein a cross-sectional shape of the first reflective electrode and the second reflective electrode comprises a cup shape, and
wherein a second horizontal width of the first reflective electrode or the second reflective electrode is longer than a horizontal width of the light emitting structure.
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