| CPC H10H 20/814 (2025.01) [H01L 25/0753 (2013.01); H01S 5/0071 (2013.01); H01S 5/0203 (2013.01); H01S 5/40 (2013.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01); H10H 20/0363 (2025.01)] | 12 Claims |

|
1. A radiation emitting semiconductor chip comprising
a semiconductor body comprising an active region configured to generate electromagnetic radiation,
a resonator comprising a first end region and a second end region, and
at least one recess in the semiconductor body, which completely penetrates the active region, wherein
the active region is arranged in the resonator, and
the recess presets a reflectivity for the electromagnetic radiation, and
a highly reflective mirror layer is arranged on the semiconductor body in the second end region, wherein
the recess is arranged in the first end region or the recess is arranged between the first end region and the second end region,
a first contact layer is arranged on the semiconductor body, which is configured to impress a current into the semiconductor body,
a second contact layer is arranged on the semiconductor body,
the first contact layer is spaced apart from the second contact layer in lateral direction, and
the recess is arranged between the first contact layer and the second contact layer.
|