| CPC H10H 20/812 (2025.01) [H01L 21/02458 (2013.01); H01L 21/0254 (2013.01); H01L 21/02579 (2013.01); H10H 20/8162 (2025.01); H10D 62/824 (2025.01); H10H 20/8242 (2025.01); H10H 20/8252 (2025.01)] | 18 Claims |

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1. A semiconductor device, comprising:
a first semiconductor structure;
a second semiconductor structure on the first semiconductor structure;
an active region between the first semiconductor structure and the second semiconductor structure, wherein the active region comprises a well layer and a barrier layer, wherein the barrier layer has a band gap;
a first electron blocking region between the second semiconductor structure and the active region, wherein the first electron blocking region layer comprises a band gap which is greater than the band gap of the barrier layer;
a first aluminum-containing layer between the first electron blocking region and the active region, wherein the first aluminum-containing layer has a band gap greater than the band gap of the first electron blocking region;
a confinement layer between the first aluminum-containing layer and the active region; and
a second aluminum-containing layer between the first electron blocking region and the confinement layer, wherein the second aluminum-containing layer comprises a band gap which is greater than the band gap of the barrier layer and the band gap of the first electron blocking region;
wherein a thickness of the first aluminum-containing layer is smaller than a thickness of the confinement layer; and
wherein a thickness of the second aluminum-containing layer is smaller than the thickness of the confinement layer.
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