US 12,439,691 B2
Array substrate and display apparatus comprising oxidization protective layer on copper conductive layer
Jiayu He, Beijing (CN); Ce Ning, Beijing (CN); Zhengliang Li, Beijing (CN); Hehe Hu, Beijing (CN); Jie Huang, Beijing (CN); Nianqi Yao, Beijing (CN); Kun Zhao, Beijing (CN); Feifei Li, Beijing (CN); Liping Lei, Beijing (CN); and Qi Qi, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/786,177
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Aug. 26, 2021, PCT No. PCT/CN2021/114713
§ 371(c)(1), (2) Date Jun. 16, 2022,
PCT Pub. No. WO2023/024011, PCT Pub. Date Mar. 2, 2023.
Prior Publication US 2024/0186330 A1, Jun. 6, 2024
Int. Cl. H10D 86/60 (2025.01); H10D 86/40 (2025.01)
CPC H10D 86/60 (2025.01) [H10D 86/441 (2025.01)] 13 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a base substrate;
a conductive layer, arranged on the base substrate, wherein a material of the conductive layer comprises copper; and
an oxidization protective layer, arranged on a side, facing away from the base substrate, of the conductive layer; wherein a material of the oxidization protective layer comprises tungsten;
wherein the base substrate comprises a functional region; the functional region comprises a plurality of first pads arranged on the base substrate; the plurality of first pads are bonded with a plurality of light-emitting units; the conductive layer comprises an first region and a second region; and the first region in the conductive layer is the plurality of first pads;
wherein the base substrate further comprises a bonding region; the bonding region comprises a plurality of second pads arranged on the base substrate; the plurality of second pads are bonded with a circuit board; the second pads and the conductive layer are arranged on a same film layer; and the oxidization protective layer is arranged on a side, facing away from the base substrate, of the plurality of second pads;
wherein the array substrate further comprises a first routing wire layer arranged between the plurality of first pads and the base substrate;
the first routing wire layer comprises a first metal layer, a first routing wire sub-layer and a second metal layer which are arranged in a stacked mode;
the plurality of first pads are electrically connected with the second metal layer, and the plurality of second pads are electrically connected with the second metal layer; and
materials of the first metal layer and the second metal layer comprise a molybdenum-niobium alloy, and a material of the first routing wire sub-layer comprises copper.