US 12,439,646 B2
Oxide semiconductor device comprising oxygen vacancies
Teawon Kim, Hwaseong-si (KR); Hyung Joon Kim, Yongin-si (KR); Yong-Suk Tak, Seoul (KR); Yurim Kim, Suwon-si (KR); and Kongsoo Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 17, 2022, as Appl. No. 17/697,423.
Claims priority of application No. 10-2021-0107127 (KR), filed on Aug. 13, 2021.
Prior Publication US 2023/0052762 A1, Feb. 16, 2023
Int. Cl. H10D 30/67 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC H10D 30/6755 (2025.01) [H10D 30/673 (2025.01); H10D 86/423 (2025.01); H10D 86/60 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
an oxide semiconductor layer on a substrate, the oxide semiconductor layer including
a first part and a pair of second parts, and
each of the second parts of the pair of second parts are spaced apart from each other across the first part;
a gate electrode on the first part of the oxide semiconductor layer; and
a pair of electrodes on corresponding second parts of the pair of second parts,
wherein a first thickness of the first part of the oxide semiconductor layer is less than a second thickness of each of the second parts, and
a concentration of oxygen vacancies in the first part of the oxide semiconductor layer is less than a concentration of oxygen vacancies in each of the second parts,
wherein a bottom surface of the first part is at a same height as that of a bottom surface of each of the second parts, and
wherein the oxide semiconductor layer is a single layer including of one or more of amorphous oxide semiconductor, crystalline oxide semiconductor and polycrystalline oxide semiconductor.