US 12,439,614 B2
Multi-capacitor module including a stacked metal-insulator-metal (MIM) structure
Yaojian Leng, Vancouver, WA (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Aug. 4, 2022, as Appl. No. 17/881,064.
Claims priority of provisional application 63/356,607, filed on Jun. 29, 2022.
Prior Publication US 2024/0006472 A1, Jan. 4, 2024
Int. Cl. H01L 23/522 (2006.01); H10B 12/00 (2023.01); H10D 1/00 (2025.01); H10D 1/68 (2025.01)
CPC H10D 1/042 (2025.01) [H01L 23/5223 (2013.01); H10B 12/038 (2023.02); H10B 12/0387 (2023.02); H10B 12/37 (2023.02); H10D 1/043 (2025.01); H10D 1/696 (2025.01); H10D 1/716 (2025.01)] 23 Claims
OG exemplary drawing
 
1. A multi-capacitor module, comprising:
a stacked metal-insulator-metal (MIM) structure including:
a cup-shaped first electrode;
a cup-shaped first insulator formed over the cup-shaped first electrode;
a cup-shaped second electrode formed over the cup-shaped first insulator;
a cup-shaped second insulator formed over the cup-shaped second electrode;
a third electrode formed over the cup-shaped second insulator;
a first sidewall spacer located between a vertically-extending first electrode sidewall of the cup-shaped first electrode and a vertically-extending first insulator sidewall of the cup-shaped first insulator;
a second sidewall spacer located between a vertically-extending second electrode sidewall of the cup-shaped second electrode and a vertically-extending second insulator sidewall of the cup-shaped second insulator;
wherein the cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor; and
wherein the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor.