| CPC H10B 61/22 (2023.02) [H10D 30/501 (2025.01); H10N 50/01 (2023.02); H10N 50/80 (2023.02); H10N 59/00 (2023.02); H10B 63/30 (2023.02); H10N 50/10 (2023.02)] | 24 Claims |

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20. A semiconductor structure comprising:
a magnetoresistive random access memory (MRAM) device region comprising a MRAM comprising a first electrode, a MRAM stack, and a second electrode, and located in a back side of a wafer, a first transistor having a first source/drain structure located beneath the MRAM, and a first back side source/drain contact structure directly connecting the first electrode of the MRAM to a first source/drain structure of a first transistor, wherein the first back side source/drain contact structure has an outermost sidewall that is substantially vertically aligned to an outermost sidewall of both the first source/drain structure of the first transistor and the first electrode; and
a logic device region located adjacent to the MRAM device region, wherein the logic device region comprises a second transistor located in a front side of the wafer and having a first source/drain structure located on a first side of a functional gate structure of the second transistor, and a second back side source/drain contact structure directly connecting the first source/drain structure of the functional gate structure of second transistor to a back side power rail.
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