US 12,439,589 B2
Integrated circuit device
Jongin Kang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 9, 2023, as Appl. No. 18/119,556.
Claims priority of application No. 10-2022-0083161 (KR), filed on Jul. 6, 2022.
Prior Publication US 2024/0015955 A1, Jan. 11, 2024
Int. Cl. H10B 12/00 (2023.01); H10D 64/27 (2025.01)
CPC H10B 12/488 (2023.02) [H10D 64/513 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit device comprising:
a substrate comprising a plurality of active regions arranged in a line in a first horizontal direction, each of the plurality of active regions are spaced apart from each other;
a device isolation film arranged on the substrate to surround the plurality of active regions; and
a word line arranged on the plurality of active regions and the device isolation film, the word line extending lengthwise in the first horizontal direction,
wherein the word line comprises:
a plurality of first conductive patterns spaced apart from each other in the first horizontal direction, each of the plurality of first conductive patterns covering a first pair of active regions of the plurality of active regions that are immediately adjacent to each other in the first horizontal direction, and a first portion of the device isolation film between each active region of the first pair of active regions, each active region of the first pair of active regions being spaced apart from each other by a first separation distance in the first horizontal direction; and
a plurality of second conductive patterns arranged one-by-one between the plurality of first conductive patterns, each of the plurality of second conductive patterns covering a second portion of the device isolation film between a second pair of active regions of the plurality of active regions that are immediately adjacent to each other in the first horizontal direction, each active region of the second pair of active regions being spaced apart from each other by a second separation distance that is greater than the first separation distance in the first horizontal direction, and
wherein a first vertical distance from a main surface of the substrate to a lowermost surface of each of the plurality of first conductive patterns is greater than a second vertical distance from the main surface of the substrate to a lowermost surface of each of the plurality of second conductive patterns.