US 12,439,586 B2
Integrated assemblies having voltage sources coupled to shields and/or plate electrodes through capacitors
Jiyun Li, Boise, ID (US); and Scott J. Derner, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jul. 28, 2022, as Appl. No. 17/876,461.
Application 17/876,461 is a continuation of application No. 16/785,942, filed on Feb. 10, 2020, granted, now 11,437,381.
Prior Publication US 2022/0384448 A1, Dec. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H10B 12/00 (2023.01); G11C 11/4074 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01); H01L 23/522 (2006.01)
CPC H10B 12/31 (2023.02) [G11C 11/4074 (2013.01); G11C 11/4085 (2013.01); G11C 11/4091 (2013.01); H01L 23/5225 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An integrated assembly, comprising:
first conductive lines extending along a first direction;
second conductive lines over the first conductive lines and extending along a second direction which crosses the first direction; the second conductive lines being operatively proximate active structures to gatedly couple a first set of capacitors to the first conductive lines through the active structures;
shield structures between the first conductive lines and electrically coupled to a voltage through a second set of capacitors; and
wherein the shield structures extend upwardly from a conductive plate, with said conductive plate extending to under the first conductive lines.