US 12,439,572 B2
Thermal solution as an effective EMI shield
Justin Huttula, Portland, OR (US); Bala Subramanya, Bangalore (IN); Juha Paavola, Hillsboro, OR (US); Mark Carbone, Cupertino, CA (US); Todd Smith, Hillsboro, OR (US); Kari Mansukoski, Hillsboro, OR (US); Samarth Alva, Bangalore (IN); Satyajit Siddharay Kamat, Bangalore (IN); and Nagaraj K, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Feb. 26, 2021, as Appl. No. 17/186,092.
Prior Publication US 2021/0235603 A1, Jul. 29, 2021
Int. Cl. H05K 9/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 9/0081 (2013.01) [H05K 7/20336 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A vapor chamber, comprising:
a plurality of connectors configured to couple to a circuit board,
wherein the plurality of connectors extends from a bottom of the vapor chamber,
wherein the plurality of connectors is configured to fix the vapor chamber to the circuit board such that the bottom thermally couples to a heat source on the circuit board, and
wherein the connectors include a removable catch which is configured such that, when removed, the catch releases the vapor chamber from the circuit board.