US 12,439,571 B2
Thermal element for a current sensing structure
Dietmar Spitzer, Völkermarkt (AT); Giampiero Ciammetti, Villach (AT); and Gaetano Formato, Villach (AT)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Mar. 10, 2023, as Appl. No. 18/181,994.
Prior Publication US 2024/0306350 A1, Sep. 12, 2024
Int. Cl. H05K 7/20 (2006.01); G01R 15/20 (2006.01)
CPC H05K 7/209 (2013.01) [G01R 15/207 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A system, comprising:
a busbar to conduct a current, wherein the busbar includes a sensing structure that includes a defined region of the busbar having a reduced area for current flow to increase a magnetic field produced by the current;
a magnetic sensor to sense the magnetic field produced by the current in the defined region of the busbar, wherein the magnetic sensor is arranged near the sensing structure; and
a thermal element in or near the sensing structure, wherein the thermal element is made of an electrically insulating material and facilitates dissipation of heat through the sensing structure of the busbar,
wherein the sensing structure includes one or more slits or tapers formed in the busbar to define the defined region of the busbar having the reduced area,
wherein the thermal element comprises a thermal filler premold that is arranged within one or more portions of the sensing structure,
wherein the thermal filler premold fills the one or more slits or tapers such that the thermal element is integrated in the busbar, co-planar with the busbar, and
wherein the thermal filler premold is coupled to the defined region of the busbar to dissipate heat from the defined region of the busbar.