US 12,439,568 B2
Immersion liquid cooling equipment and heat dissipation method for electronic device
Tai-Ying Tu, New Taipei (TW); Chia-Yi Wu, New Taipei (TW); Tsung-Han Li, New Taipei (TW); and Ting-Yu Pai, New Taipei (TW)
Assigned to Wiwynn Corporation, New Taipei (TW)
Filed by Wiwynn Corporation, New Taipei (TW)
Filed on Aug. 9, 2023, as Appl. No. 18/447,275.
Claims priority of provisional application 63/397,329, filed on Aug. 11, 2022.
Claims priority of application No. 112107966 (TW), filed on Mar. 6, 2023.
Prior Publication US 2024/0057291 A1, Feb. 15, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20836 (2013.01) [H05K 7/20254 (2013.01); H05K 7/203 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An immersion liquid cooling equipment, adapted for an electronic device, the immersion liquid cooling equipment comprising:
a tank, configured to accommodate a first fluid, the electronic device being disposed in the tank and configured to be immersed in the first fluid in the form of a liquid;
a condenser, disposed in the tank and disposed above the first fluid in the form of a liquid;
a cold plate, disposed in the tank and in thermal contact with at least one high power commodity of the electronic device; and
a first pipe, disposed and extending between an exterior and an interior of the tank, the first pipe communicating with the condenser and the cold plate, and the first pipe being configured to receive a second fluid to flow through the condenser and the cold plate.