US 12,439,565 B2
Heat sink assembly and power converter assembly
Roman Kögler, Nuremberg (DE); Lutz Namyslo, Hausen (DE); and Thomas Schwinn, Herzogenaurach (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 18/032,441
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Aug. 19, 2021, PCT No. PCT/EP2021/073020
§ 371(c)(1), (2) Date Apr. 18, 2023,
PCT Pub. No. WO2022/083920, PCT Pub. Date Apr. 28, 2022.
Claims priority of application No. 20203605 (EP), filed on Oct. 23, 2020.
Prior Publication US 2024/0032254 A1, Jan. 25, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20509 (2013.01) [H05K 7/20909 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A heat sink assembly for a plurality of semiconductor components, the heat sink assembly comprising:
a first heat sink; and
a second heat sink the first and second heat sinks each having a component side and a cooling fin side equipped with cooling fins arranged in series such that a coolant initially flows in a direction of flow through cooling channels formed by the cooling fins of the first heat sink and subsequently flows through cooling channels formed by the cooling fins of the second heat sink;
an interspace; and
a cover which covers the interspace, the cover including a first guidance element and a second guidance element which are disposed within the interspace;
wherein a first inlet cross section which, on an inlet side of the first heat sink, is composed of individual cross sections of the associated cooling channels of the first heat sink, is reduced via a partition, which at least partially covers the cooling channels on the inlet side of the first heat sink in comparison with a second inlet cross section, which, on an inlet side of the second heat sink, is composed of individual cross sections of the associated cooling channels of the second heat sink.