| CPC H05K 7/2049 (2013.01) [H05K 7/20254 (2013.01); G02B 6/4268 (2013.01); H01L 23/40 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H04B 1/036 (2013.01)] | 20 Claims |
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1. A cooling module comprising:
a mounting element configured to be coupled to a support structure of an electronic device to mount the cooling module to the support structure at a receptacle of the electronic device configured to removably receive a removable electronic module in the receptacle, the mounting element comprising a plurality of engagement members;
a cold plate movably coupled to the mounting element;
a force application member comprising a plurality of spring fingers, disposed between the mounting element and the cold plate, and movable relative to the mounting element; and
a lever connected to the mounting element and the force application member, and configured to be shifted between an actuated state and an unactuated state,
wherein the lever and the plurality of engagement members are configured to move the force application member between a first position and a second position in response to the lever being shifted between the unactuated state and the actuated state,
wherein, as the lever is shifted from the unactuated state to the actuated state, the lever moves the force application member along a first direction and in response the plurality of engagement members moves the force application member to move along a second direction perpendicular to the first direction, such that the force application member is moved to the second position,
wherein, in a state of the removable electronic module received in the receptacle, the lever in the actuated state, and the force application member in the second position: the plurality of spring fingers is compressed and apply spring forces to the cold plate urging the cold plate against the removable electronic module to establish a thermal contact between the cold plate and the removable electronic module.
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