US 12,439,562 B2
Thermal dissipation
Richard Rembert, Quai xen Chartreuse (FR); Fanny Laporte, Villaz (FR); and Catherine Cadieux, Grenoble (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on Nov. 17, 2022, as Appl. No. 17/989,173.
Claims priority of application No. 2112736 (FR), filed on Nov. 30, 2021.
Prior Publication US 2023/0171927 A1, Jun. 1, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) 23 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
an insulating substrate having a first surface and a second surface and comprising a network of thermally-conductive vias and a first layer made of a first thermally-conductive material located in and having an upper surface coplanar with the first surface of the insulating substrate and further having a lower surface in contact with the network of thermally-conductive vias;
a heat dissipation interface comprising a second layer made of a second thermally-conductive material, the first material being different from the second material, stacked on and in contact with the first layer made of the first thermally conductive material above the upper surface of the insulating substrate;
wherein at least one opening thoroughly crosses both the first layer and the second layer;
wherein sidewalls of the at least one opening which crosses the first layer are in alignment with sidewalls of the at least one opening which crosses the second layer; and
wherein said at least one opening in the first layer is filled by material of the insulating substrate.