US 12,439,558 B2
Vapor chamber and electronic apparatus
Masahiro Kitamura, Kanagawa (JP); Takateru Adachi, Kanagawa (JP); Shusaku Tomizawa, Kanagawa (JP); and Hajime Yoshizawa, Kanagawa (JP)
Assigned to Lenovo (Singapore) Pte. Ltd., Singapore (SG)
Filed by Lenovo (Singapore) Pte. Ltd., Singapore (SG)
Filed on Apr. 13, 2023, as Appl. No. 18/299,832.
Claims priority of application No. 2022-094612 (JP), filed on Jun. 10, 2022.
Prior Publication US 2023/0403823 A1, Dec. 14, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H05K 7/20336 (2013.01) [G06F 1/203 (2013.01); G06F 1/206 (2013.01); H01L 23/427 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H05K 7/20136 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A vapor chamber comprising:
a first metal plate;
a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate;
a plurality of supporting columns rising between the first metal plate and the second metal plate inside the sealed space, and
a wick stored inside the sealed space,
wherein
the first metal plate has a through-hole communicating with the sealed space;
the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space, and
the supporting columns are placed at positions surrounding the through-hole.