US 12,439,556 B2
MEMS-based system for cooling a vapor chamber
Prabhu Sathyamurthy, San Jose, CA (US); Suryaprakash Ganti, Los Altos, CA (US); Seshagiri Rao Madhavapeddy, La Jolla, CA (US); Vikram Mukundan, San Ramon, CA (US); and Narayana Prasad Rayapati, Mountain View, CA (US)
Assigned to Frore Systems Inc., San Jose, CA (US)
Filed by Frore Systems Inc., San Jose, CA (US)
Filed on Dec. 16, 2022, as Appl. No. 18/083,414.
Claims priority of provisional application 63/291,760, filed on Dec. 20, 2021.
Prior Publication US 2023/0200011 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20309 (2013.01) [H05K 7/20327 (2013.01); H05K 7/20381 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A server system, comprising:
a vapor chamber in thermal communication with a plurality of heat sources, the vapor chamber including a plurality of external fins;
at least one array of microelectromechanical system (MEMS) jets coupled to at least one fin of the plurality of external fins, the at least one array of MEMS jets arranged to cause a fluid to impinge on a surface corresponding to the at least one fin of the plurality of external fins of the vapor chamber, the surface being selected from an external surface of the at least one fin and a heat spreader surface thermally coupled to the external surface of the at least one fin; and
a duct system coupled with the at least one array of MEMS jets and configured to direct heated fluid from proximate to the at least one fin to distal from the at least one fin.