US 12,439,555 B2
Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device
Zhiqiang Wang, Shenzhen (CN); Hanghang Dong, Shenzhen (CN); Xiaofeng Hu, Shenzhen (CN); and Junjie Yang, Shenzhen (CN)
Assigned to HONOR DEVICE CO., LTD., Shenzhen (CN)
Appl. No. 18/036,273
Filed by HONOR DEVICE CO., LTD., Shenzhen (CN)
PCT Filed Aug. 26, 2022, PCT No. PCT/CN2022/115230
§ 371(c)(1), (2) Date May 10, 2023,
PCT Pub. No. WO2023/071487, PCT Pub. Date May 4, 2023.
Claims priority of application No. 202111257605.5 (CN), filed on Oct. 27, 2021.
Prior Publication US 2023/0413481 A1, Dec. 21, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2029 (2013.01) [H05K 7/2039 (2013.01)] 20 Claims
OG exemplary drawing
 
9. An electronic device, comprising:
a heat dissipation structure, comprising:
a substrate, provided with an electronic element;
a heat dissipation cover, connected to the substrate and surrounding the electronic element, wherein the heat dissipation cover and the substrate form an accommodation cavity that accommodates the electronic element; and
a phase-change thermally conductive material, disposed in the accommodation cavity, wherein a melting point of the phase-change thermally conductive material is 35˜65° C.;
the heat dissipation structure further comprises a heat dissipation module attached to a top wall of the heat dissipation cover;
an opening is disposed on the top wall, a thermally conductive column protrudes from an outer wall of the heat dissipation module, and the thermally conductive column passes through the opening and extends into the accommodation cavity, wherein the phase-change thermally conductive material is configured to melt and wrap itself to a bottom wall and a peripheral wall of the thermally conductive column.