US 12,439,552 B2
Cooling module for a circuit module having a plurality of chipsets
Ernesto Ferrer Medina, Aguadilla, PR (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US)
Filed on Jul. 22, 2022, as Appl. No. 17/814,453.
Prior Publication US 2024/0032242 A1, Jan. 25, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 1/0203 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A cooling module for a circuit module, comprising:
a first cooling component comprising a plurality of microchannel blocks thermally coupled to a plurality of chipsets of the circuit module, wherein each microchannel block comprises a plurality of elongated fins to define a plurality of microchannels; and
a second cooling component disposed on the first cooling component, comprising an inlet port, an outlet port, and a plurality of distribution conduits fluidically coupled to the inlet port and the outlet port, wherein each distribution conduit of the plurality of distribution conduits is disposed on one or more microchannel blocks of the plurality of microchannel blocks, and directs a flow of coolant from the inlet port to the outlet port through the plurality of microchannels of the one or more microchannel blocks to absorb waste heat transferred to the one or more microchannel blocks from at least one chipset of the plurality of chipsets,
wherein the plurality of distribution conduits comprises a first set of distribution conduits arranged along a first column and a second set of distribution conduits arranged along a second column, and wherein each of the first set of distribution conduits and the second set of distribution conduits defines a serpentine flow path aligned over a portion of a respective chipset of the plurality of chipsets.