US 12,439,548 B1
Systems and methods for cooling circuit board components in a compact signal hub
Ming-Tsung Su, Taipei (TW); Chun-Wen Wang, Taoyuan (TW); Haohsiu Huang, Cupertino, CA (US); Huang Yu Ting, Hsinchu (TW); Yuhan Liu, Taipei (TW); and ChiuWen Chen, New Taipei (TW)
Assigned to RIGH, INC., Palo Alto, CA (US)
Filed by RIGH, INC., Palo Alto, CA (US)
Filed on Dec. 20, 2024, as Appl. No. 18/989,024.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20154 (2013.01) [H05K 7/2039 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A system comprising:
a signal hub housing;
a top shell;
a bottom shell;
an ambient air gap;
a top cooling plate;
a radio frequency (RF) board; and
a middle cooling plate,
wherein the top cooling plate is coupled to a top surface of the RF board;
wherein the middle cooling plate is coupled to a bottom surface of the RF board;
wherein the top shell is configured to couple to the bottom shell to form the signal hub housing,
wherein the ambient air gap is formed between the top shell and the bottom shell when the top shell is coupled to the bottom shell,
wherein the ambient air gap extends around a perimeter of the signal hub housing along a same plane, and
wherein the ambient air gap is configured to enable ambient air to pass over the top cooling plate, the RF board, and the middle cooling plate.