US 12,439,543 B2
Power supply cooling structure
Qun Lu, Lexington, MA (US)
Assigned to AA Power Inc., Boston, MA (US)
Filed by AA Power Inc., Boston, MA (US)
Filed on Aug. 30, 2023, as Appl. No. 18/240,346.
Claims priority of provisional application 63/375,549, filed on Sep. 14, 2022.
Prior Publication US 2024/0090153 A1, Mar. 14, 2024
Int. Cl. H05K 7/14 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/14322 (2022.08) [H05K 1/021 (2013.01); H05K 7/202 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first case comprising a top portion and a bottom portion opposite to each other;
a first circuit board within the first case, the first circuit board having a first surface and a second surface opposite to each other, and the first circuit board attached to the top portion of the first case via the second surface of the first circuit board, with at least one first heat-generating device mounted on the first surface of the first circuit board;
a first thermal pad disposed between the first circuit board and the top portion of the first case; and
a second circuit board within the first case, the second circuit board having a first surface and a second surface opposite to each other, and the second circuit board attached to the bottom portion of the first case via the second surface of the second circuit board, with at least one second heat-generating device mounted on the first surface of the second circuit board; and
a first thermally conductive potting adhesive layer disposed between the first thermal pad and the first circuit board.