US 12,439,542 B2
Standoff and support structures for reliable land grid array and hybrid land grid array interconnects
Mark K. Hoffmeyer, Rochester, MN (US); Sarah K. Czaplewski-Campbell, Rochester, MN (US); Brian Beaman, Cary, NC (US); and Yuet-Ying Yu, Hopewell Junction, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jun. 29, 2022, as Appl. No. 17/853,249.
Prior Publication US 2024/0008208 A1, Jan. 4, 2024
Int. Cl. H05K 7/10 (2006.01); H01L 21/48 (2006.01); H01R 12/57 (2011.01); H01R 13/24 (2006.01); H01R 43/20 (2006.01); H01R 12/71 (2011.01)
CPC H05K 7/1069 (2013.01) [H01L 21/4853 (2013.01); H01R 12/57 (2013.01); H01R 13/2442 (2013.01); H01R 13/2485 (2013.01); H01R 43/20 (2013.01); H01L 21/4814 (2013.01); H01L 21/4846 (2013.01); H01L 21/486 (2013.01); H01L 2924/15313 (2013.01); H01R 12/714 (2013.01); H01R 13/24 (2013.01); H01R 13/245 (2013.01); H01R 13/2478 (2013.01); H05K 7/10 (2013.01); H05K 7/1053 (2013.01); H05K 7/1061 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for producing a land grid array (LGA) socket connector assembly, comprising:
providing a carrier having a first carrier thickness with an array of vias, each having a first diameter;
providing pockets around top surfaces of the vias, each pocket being substantially circular, having a second diameter greater than the first diameter, and having a second carrier thickness that is less than the first carrier thickness;
providing socket contact springs, each comprising:
a hole support structure that supports the socket contact spring within a corresponding via of the array of vias; and
a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly;
wherein a portion of the carrier having the first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load.