US 12,439,533 B2
Heat insulation pad and electronic device with heat insulation pad
Yu-Jung Lin, Taipei (TW); Ing-Jer Chiou, Taipei (TW); and Cheng-Yu Wang, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTEK COMPUTER INC., Taipei (TW)
Filed on Jun. 2, 2023, as Appl. No. 18/328,046.
Claims priority of application No. 112105703 (TW), filed on Feb. 17, 2023.
Prior Publication US 2024/0284610 A1, Aug. 22, 2024
Int. Cl. H05K 5/02 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 7/14 (2006.01); B32B 27/06 (2006.01)
CPC H05K 5/0211 (2022.08) [B32B 3/266 (2013.01); B32B 5/18 (2013.01); B32B 7/14 (2013.01); B32B 27/065 (2013.01); B32B 2307/304 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/00 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A heat insulation pad, applied to an electronic device, wherein the electronic device comprises a housing and a heat source, the housing comprises an inner side surface, and the heat insulation pad comprises:
a first contact layer, adapted to attach to the inner side surface;
a second contact layer, adapted to contact the heat source; and
a hole layer stack structure, comprising a plurality of hole layers stacked in sequence and located between the first contact layer and the second contact layer,
wherein both the first contact layer and the second contact layer are polymer layers without holes.