US 12,439,527 B2
Mounting board manufacturing method and flux coating device
Masayuki Mantani, Saga (JP); Tadahiko Sakai, Fukuoka (JP); Tadashi Maeda, Fukuoka (JP); and Yuki Yoshioka, Fukuoka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 18/043,955
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Jul. 5, 2021, PCT No. PCT/JP2021/025337
§ 371(c)(1), (2) Date Mar. 3, 2023,
PCT Pub. No. WO2022/054384, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 2020-154141 (JP), filed on Sep. 14, 2020; and application No. 2020-154142 (JP), filed on Sep. 14, 2020.
Prior Publication US 2024/0015893 A1, Jan. 11, 2024
Int. Cl. H05K 3/34 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01)
CPC H05K 3/3485 (2020.08) [H05K 1/181 (2013.01); H05K 3/1275 (2013.01); H05K 3/3489 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0195 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land of a substrate, the method comprising:
a paste disposing step of disposing a solder paste on the land;
a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area coated with solder, on the land;
a breaking step of breaking a residue covering a surface of the precoated area by pressing a tool against the precoated area;
a flux disposing step of disposing a flux on the precoated area;
a component placement step of placing an electronic component on the substrate, with the terminal of the electronic component aligned with the precoated area; and
a reflow step of heating the substrate to melt the precoated area, to solder the terminal to the land.