US 12,439,526 B2
Method for additive manufacturing electronics and a printing support for the manufacturing
Jörg Sander, Ulm (DE)
Assigned to HENSOLDT Sensors GmbH, Taufkirchen (DE)
Filed by HENSOLDT Sensors GmbH, Taufkirchen (DE)
Filed on Sep. 27, 2023, as Appl. No. 18/373,866.
Claims priority of application No. 22198536 (EP), filed on Sep. 28, 2022.
Prior Publication US 2024/0107681 A1, Mar. 28, 2024
Int. Cl. H05K 3/12 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); H05K 1/02 (2006.01); B29C 64/112 (2017.01); B29L 31/34 (2006.01); H05K 1/16 (2006.01)
CPC H05K 3/125 (2013.01) [B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); H05K 1/0268 (2013.01); B29C 64/112 (2017.08); B29K 2995/0006 (2013.01); B29L 2031/34 (2013.01); H05K 1/16 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/163 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for additive manufacturing of an electronic device, the method comprising:
providing a printing support with an electric circuitry embedded in a dielectric encapsulation and at least one supply terminal connected to the electric circuitry;
additive printing the electronic device on the printing support by forming a conductive structure embedded in a dielectric base material and at least one device terminal exposed on a surface of the electronic device, wherein the at least one supply terminal of the printing support is arranged to electrically contact the at least one device terminal; and
applying electric signals from the at least one supply terminal to the at least on device terminal to measure an electric characteristic of the conductive structure during the process of additive printing of the electronic device.