US 12,439,525 B2
Method for operating a metal drop ejecting three-dimensional (3D) object printer to form vias in printed circuit boards with conductive metal
Denis Cormier, Pittsford, NY (US); Santokh S. Badesha, Pittsford, NY (US); and Varun Sambhy, Pittsford, NY (US)
Assigned to Additive Technologies LLC, Palm City, FL (US)
Filed by ADDITIVE TECHNOLOGIES LLC, Palm City, FL (US)
Filed on May 17, 2023, as Appl. No. 18/318,974.
Application 18/318,974 is a division of application No. 17/155,455, filed on Jan. 22, 2021, granted, now 11,737,216.
Prior Publication US 2023/0309241 A1, Sep. 28, 2023
Int. Cl. H05K 3/12 (2006.01); H05K 3/40 (2006.01); H05K 13/00 (2006.01)
CPC H05K 3/125 (2013.01) [H05K 3/4046 (2013.01); H05K 3/4053 (2013.01); H05K 13/0092 (2013.01); H05K 2203/128 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for operating a metal drop ejecting apparatus comprising:
using a digital data model of a substrate to identify a bulk metal to be received and melted in a printhead of the metal drop ejecting apparatus;
identifying locations of via holes in the substrate using the digital data model, wherein each of the via holes is defined by at least one wall;
identifying a smallest diameter for the via holes at the identified locations;
identifying a nozzle diameter for the ejector corresponding to the identified smallest diameter;
confirming that a nozzle with the identified nozzle diameter is installed in the ejection head;
generating machine ready instructions for moving and operating at least one ejector in the printhead to fill the via holes at the identified locations; and
executing the generated machine ready instructions to operate the ejector, at least one actuator, and the printhead to melt the bulk metal in the printhead, position the ejector opposite the identified locations for the via holes in the substrate, and eject drops of the melted bulk metal toward the via holes at the identified locations.
 
11. A method for operating a metal drop ejecting apparatus comprising:
using a digital data model of a substrate to identify a bulk metal to be received and melted in a printhead of the metal drop ejecting apparatus;
identifying locations of via holes in the substrate using the digital data model, each of the via holes defined by at least one wall;
generating machine ready instructions for moving the at least one ejector in the printhead, positioning the at least one ejector opposite the via holes to eject the drops of melted bulk metal into the via holes without the drops landing on the walls of the via holes, and operating at least one ejector in the printhead to fill the via holes at the identified locations; and
executing the generated machine ready instructions to operate the ejector, at least one actuator, and the printhead to melt the bulk metal in the printhead, position the ejector opposite the identified locations for the via holes in the substrate and eject drops of the melted bulk metal toward the via holes at the identified locations without the drops landing on the walls of the via holes.