US 12,439,520 B2
Circuit board with embedded resistors and method for fabricating the same
Xiao-Juan Zhang, Hebei Province (CN); and Gang Yuan, Hebei Province (CN)
Assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD., Hebei Province (CN); AVARY HOLDING (SHENZHEN) CO., LTD., Shenzhen (CN); and GARUDA TECHNOLOGY CO., LTD., New Taipei (TW)
Filed by HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd., Hebei Province (CN); Avary Holding (Shenzhen) Co., Ltd., Shenzhen (CN); and Garuda Technology Co., Ltd., New Taipei (TW)
Filed on Aug. 30, 2023, as Appl. No. 18/458,566.
Claims priority of application No. 202310998786.X (CN), filed on Aug. 9, 2023.
Prior Publication US 2025/0056725 A1, Feb. 13, 2025
Int. Cl. H05K 1/16 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/167 (2013.01) [H05K 3/423 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/128 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a circuit substrate; and
a variable resistive region, located in the circuit substrate, and the variable resistive region comprises:
a first resistive layer, electrically connected to the circuit substrate;
a second resistive layer, located on and overlapping the first resistive layer; and
a liquid metal material, distributed on and electrically connected to the first resistive layer;
wherein when the liquid metal material is under an initial temperature, the liquid metal material is spaced from the second resistive layer, and the liquid metal material is not electrically connected to the second resistive layer;
wherein when the liquid metal material is under a first temperature higher than the initial temperature, the liquid metal material touches the second resistive layer, and the liquid metal material is electrically connected to the second resistive layer.