US 12,439,518 B2
Information handling system dual layer modular printed circuit board interposer
Allen B. McKittrick, Cedar Park, TX (US); Jeffrey D. Kane, Austin, TX (US); Paul Lalinde, Spring, TX (US); and Jonathan Isom, Austin, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Dec. 18, 2023, as Appl. No. 18/542,992.
Prior Publication US 2025/0203777 A1, Jun. 19, 2025
Int. Cl. H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/142 (2013.01) [H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10984 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An information handling system comprising:
a housing;
a main printed circuit board coupled to the housing;
a central processing unit coupled to the main printed circuit board and operable to execute instructions that process information, the main printed circuit board having plural contact pads exposed at an upper and lower surface;
a graphics printed circuit board coupled to the housing;
a graphics processing unit coupled to the graphics printed circuit board and operable to process the information to define visual images for presentation at a display, the graphics printed circuit board having plural contact pads exposed at an upper and lower surface; and
an interposer having an upper portion and a lower portion, the upper portion having contacts that interface with the upper surface contact pads of both the graphics printed circuit board and the main printed circuit board, the lower portion having contacts that interface with the lower surface contact pads of both the graphics printed circuit board and the main printed circuit board, the interposer communication information between the central processing unit and the graphics processing unit.