US 12,439,515 B2
Power module and manufacturing method thereof
Jianxin Chen, Shanghai (CN); Kun Jiang, Shanghai (CN); and Quansong Luo, Shanghai (CN)
Assigned to Delta Electronics, Inc., Taoyuan (TW)
Filed by Delta Electronics, Inc., Taoyuan (TW)
Filed on Jan. 12, 2023, as Appl. No. 18/096,356.
Claims priority of application No. 202210134656.7 (CN), filed on Feb. 14, 2022.
Prior Publication US 2023/0262889 A1, Aug. 17, 2023
Int. Cl. H02M 7/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01)
CPC H05K 1/113 (2013.01) [H02M 7/003 (2013.01); H05K 1/0201 (2013.01); H05K 3/30 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A power module, comprising:
a first electronic assembly comprising at least one pin; and
a second electronic assembly comprising a first surface and a second surface opposite to each other, wherein the first surface is more adjacent to the first electronic assembly than the second surface, and a direction from the first surface toward the second surface is defined as a reference direction, wherein the second electronic assembly further comprises:
a first region having a first thickness in the reference direction; and
a second region having a second thickness in the reference direction, wherein the second thickness is less than the first thickness, the second region comprises at least one through hole, the at least one through hole runs completely through the second electronic assembly, and the at least one pin is penetrated completely through the at least one through hole and fixed on the second electronic assembly.