US 12,439,514 B2
Electronic device having conductive contact soldered to printed circuit
Peter A Dvorak, Menlo Park, CA (US); Eric W Bates, San Jose, CA (US); Ana Papio Toda, San Jose, CA (US); Yiren Wang, Cupertino, CA (US); Hao Xu, Cupertino, CA (US); Yuan Tao, Santa Clara, CA (US); Han Wang, Campbell, CA (US); Jack R Lanzi, San Francisco, CA (US); and Ronald Lam, Berkeley, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Aug. 30, 2023, as Appl. No. 18/458,747.
Claims priority of provisional application 63/404,059, filed on Sep. 6, 2022.
Prior Publication US 2024/0080976 A1, Mar. 7, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01); H04R 1/02 (2006.01)
CPC H05K 1/11 (2013.01) [H05K 1/028 (2013.01); H05K 1/181 (2013.01); H05K 5/0217 (2013.01); H05K 7/1427 (2013.01); H04R 1/02 (2013.01); H04R 2499/11 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device comprising: a printed circuit having a hole; a conductive trace on the printed circuit; a conductive flange soldered to the conductive trace and at least partially overlapping the hole, wherein the conductive flange has a first portion soldered to the conductive trace and a second portion that extends from the first portion and into the hole in the printed circuit; a conductive contact that extends into the hole; and solder that couples the conductive contact to the conductive flange.