US 12,439,509 B2
Edge enabled void constructions
Jan-Willem Zweers, Nieuwleusen (NL); Richard Perkins, Encinitas, CA (US); and Bror Peterson, Fairview, TX (US)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Filed by Qorvo US, Inc., Greensboro, NC (US)
Filed on Mar. 27, 2023, as Appl. No. 18/190,462.
Claims priority of provisional application 63/327,376, filed on Apr. 5, 2022.
Prior Publication US 2023/0319982 A1, Oct. 5, 2023
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0243 (2013.01) [H05K 2201/10053 (2013.01); H05K 2201/10098 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a substrate;
a conductive plane comprising an edge enabled void construction (EEVC) along a geometric perimeter of the conductive plane, the EEVC having an EEVC void that defines an EEVC perimeter that extends into the conductive plane, wherein the EEVC void causes a phase change in current flow caused by a skin effect within the conductive plane;
an operating mode switching arrangement operable to cause the EEVC to selectively switch between an edge enabled void antenna, EEVA, mode of operation and an edge enabled void isolator, EEVI, mode of operation; and
a switch having a first switch port and a second switch port such that the switch is operable to be in a conducting state and a nonconducting state with respect to the first switch port and the second switch port, the first switch port being coupled to a first location of the EEVC perimeter and the second switch port being coupled to a second location of the EEVC perimeter.