US 12,439,507 B2
Safety and EMC compliant internal power plane heat sink capacitor
John S. Werner, Fishkill, NY (US); Piyush Kashyap, Highland, NY (US); Samuel R. Connor, Apex, NC (US); Yuanchen Hu, Wappingers Falls, NY (US); and Kevin O'Connell, Rochester, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Dec. 30, 2022, as Appl. No. 18/148,465.
Prior Publication US 2024/0224411 A1, Jul. 4, 2024
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/023 (2013.01) [H05K 1/0207 (2013.01); H05K 2201/10416 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An internal power plane heat sink apparatus, configured to be attached to an internal power plane of a printed circuit board, comprising:
a heat sink having a plurality of fins extending outward from the heat sink;
a compliance cage surrounding at least a portion of the heat sink; and
at least one capacitor plate contacting at least a portion of the compliance cage and extending inwards towards the heat sink and interleaving with the plurality of fins.