US 12,439,506 B2
Circuit board
Jae Hoon Ko, Gyeonggi-do (KR); Jeffrey E. Kwak, Gyeonggi-do (KR); In Myung Song, Gyeonggi-do (KR); and Chong Geun Ahn, Gyeonggi-do (KR)
Assigned to SK hynix Inc., Gyeonggi-do (KR)
Filed by SK hynix Inc., Gyeonggi-do (KR)
Filed on Dec. 2, 2022, as Appl. No. 18/073,956.
Claims priority of application No. 10-2022-0065015 (KR), filed on May 26, 2022.
Prior Publication US 2023/0389171 A1, Nov. 30, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0219 (2013.01) [H05K 1/0237 (2013.01); H05K 1/0313 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a first conductor layer including a first pad for transmitting and receiving a first signal to and from an external device;
a plurality of second conductor layers stacked on the first conductor layer; and
a third conductor layer stacked on the plurality of second conductor layers, and including a second pad for transmitting and receiving a second signal to and from the external device,
wherein at least one target conductor layer among the plurality of second conductor layers has a mesh structure and is electrically grounded, and
wherein remaining second conductor layers except for the at least one target conductor layer include respective voids and are electrically opened.