| CPC H05K 1/0218 (2013.01) | 21 Claims |

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1. A multilayer substrate comprises: a laminate including a plurality of resin layers laminated in a lamination direction; a first signal conductor provided in the laminate; a second signal conductor provided in the laminate, a position of the second signal conductor in the lamination direction being different from a position of the first signal conductor in the lamination direction, at least a portion of the second signal conductor overlapping the first signal conductor when viewed in the lamination direction; a plurality of first interlayer connection conductors passing through the resin layers in the lamination direction and electrically connecting the first signal conductor and the second signal conductor; and a plurality of second interlayer connection conductors passing through the resin layers in the lamination direction and electrically connecting the first signal conductor and the second signal conductor; wherein the plurality of first interlayer connection conductors are aligned in a first row extending along the first signal conductor when viewed in the lamination direction; the plurality of second interlayer connection conductors are aligned in a second row extending along the first signal conductor when viewed in the lamination direction; a direction perpendicular to the direction in which the first signal conductor extends, when viewed in the lamination direction, is a line width direction; a position of the second row in the line width direction is different from a position of the first row in the line width direction; each of the plurality of second interlayer connection conductors does not overlap a respective one of the plurality of first interlayer connection conductors when viewed in the line width direction, wherein one side of the lamination direction is a third direction and the other side of the lamination direction is a fourth direction; the second signal conductor is located farther in the fourth direction than the first signal conductor; the multilayer substrate further comprises: a third signal conductor that is provided in the laminate, that is located farther in the fourth direction than the second signal conductor, and that overlaps the first signal conductor and the second signal conductor when viewed in the lamination direction; and a plurality of fourth interlayer connection conductors passing through the resin layers in the lamination direction and electrically connecting the second signal conductor and the third signal conductor; and the plurality of fourth interlayer connection conductors are aligned in a third row along the second signal conductor when viewed in the lamination direction.
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