US 12,439,503 B2
Target supply device and electronic device manufacturing method
Masaki Nakano, Tochigi (JP)
Assigned to Gigaphoton Inc., Tochigi (JP)
Filed by Gigaphoton Inc., Tochigi (JP)
Filed on Dec. 6, 2023, as Appl. No. 18/531,096.
Claims priority of application No. 2023-010363 (JP), filed on Jan. 26, 2023.
Prior Publication US 2024/0260164 A1, Aug. 1, 2024
Int. Cl. H05G 2/00 (2006.01); G03F 7/00 (2006.01); G03F 7/20 (2006.01)
CPC H05G 2/0023 (2024.08) [G03F 7/70033 (2013.01); G03F 7/7065 (2013.01); G03F 7/706849 (2023.05)] 11 Claims
OG exemplary drawing
 
1. A target supply device configured to supply a liquid state target substance including tin to a concentration position of laser light to generate EUV light, the target supply device comprising:
a tank configured to contain the target substance; and
a nozzle communicating with an inside of the tank, and having a nozzle hole through which the target substance passes,
an uneven structure being formed on a surface of the nozzle provided with the nozzle hole and facing the concentration position, the uneven structure exhibiting tin repellency larger than tin repellency exhibited by a material of the surface.